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GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications

Authored on: Sep 1, 2009 by Henrik Morkner

Technical Paper

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This paper explains the general construction and fabrication of Avago's commercial Wafer Scale Packaging (WSP) process. The advantages and disadvantages of this technology are compared candidly to more traditional microwave technology through millimeter wave packaging techniques. Finally, several commercially available examples are shown as well as a glimpse into future developments.

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