datasheets.com EBN.com EDN.com EETimes.com Embedded.com PlanetAnalog.com TechOnline.com  
Events
UBM Tech
UBM Tech

RapidIO: The Serial Physical Layer

Authored on: Feb 12, 2002 by Dan Bouvier

Technical Paper

0 0
More InfoLess Info


RapidIO, a packet-switched interconnect technology for interconnecting chips on a board and boards using a backplane, is gaining popularity as an open embedded-interconnect standard. Dan Bouvier of Motorola, Chair of the RapidIO Technical Working Group, describes the high-level aspects of Serial RapidIO and some of its target applications, such as backplanes and processing farms.

For more information about the RapidIO standard, visit the RapidIO Trade Association's Web site.




RapidIO, a packet-switched interconnect technology for interconnecting chips on a board and boards using a backplane, is gaining popularity as an open embedded-interconnect standard. Dan Bouvier of Motorola, Chair of the RapidIO Technical Working Group, describes the high-level aspects of Serial RapidIO and some of its target applications, such as backplanes and processing farms.
0 comments
write a comment

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page