datasheets.com EBN.com EDN.com EETimes.com Embedded.com PlanetAnalog.com TechOnline.com  
Events
UBM Tech
UBM Tech
Welcome Guest Log In | Register

A Temperature-Aware Design Methodology

Authored on: Jun 20, 2005

Technical Paper

0 0
More InfoLess Info
This paper highlights the problems of today's constant average temperature based analysis of chips. It describes the impact of thermal gradients on the electrical characteristics of the design and proposes a method for retrofitting today's tools with temperature-aware capabilities. The analysis methods can be combined with repair techniques to avoid design guardbanding and to avoid design failures.



Please disable any pop-up blockers for proper viewing of this paper.

0 comments
write a comment

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page