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Outsmarting the Recession

Authored on: Dec 17, 2009 by Norbert Hauser

Technical Paper

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The current economic climate is putting embedded system OEMs under pressure to do more with less. Engineers are being asked to reduce development cost and risk while simultaneously producing more competitive designs. This is no easy task—staying competitive means using fewer and smaller components, meeting lower power thresholds, and maximizing performance, all while hitting ever-shrinking market windows.

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