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Die Attach and Bonding Recommendations

Authored on: Oct 16, 2008

Technical Paper / Application Note

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While Nitronex's core market is packaged RF products, we sell die to select customers for use in modules and subsystems. One benefit of Nitronex GaN devices is they are fabricated on industry standard silicon wafers so industry standard die attach and wire bonding procedures can be used. This application note describes typical procedures that have been successfully used by Nitronex in engineering and production environments and are guidelines for our die customers. As with all semiconductor assemblies, appropriate qualification should be performed to ensure a reliable process is being used.

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