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Die Handling and Storage Recommendations

Authored on: Oct 16, 2008

Technical Paper / Application Note

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Nitronex provides bare die for certain customers who wish to integrate devices into modules or other chip and wire subsystems. Unlike industry standard packaged products which have relatively uniform handling and storage requirements, bare die have vendor-specific construction and appropriate considerations must be made. This document provides guidelines to assist customers in handling and storing Nitronex GaN die in order to achieving a reliable and manufacturable design.

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