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Silicon-on-Insulator for Power-Semiconductors and Power-ICs

Authored on: Oct 29, 2007 by René P. Zingg

Technical Paper / Conference Paper

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This paper presents a solution to the increased package density and operating frequency demands of switched-mode power supplies and other power-conversion applications for nomadic applications. The benefits and drawbacks of a novel semiconductor material, Silicon-on-Insulator, are discussed.

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