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Signal Integrity (SI) Process for High-Speed (HS) Mixed Signal Analysis

Authored on: Aug 10, 2007 by Yoram Levy

Technical Paper / Conference Paper

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This white paper describes the Signal Integrity (SI) process, a numerical analysis investigation of defined electronic system specifications, conducted either at the pre-design stage or at the post-printed circuit board (PCB) layout stage. The main objectives of the SI process are to shorten the system design time and to eliminate the need for trial-and-error methods. The principal result is a clear electronic signal path from the source integrated circuit (IC) to the target IC, within a silicon technology threshold.

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