Design Con 2015
Welcome Guest Log In | Register

TI's New Space Saving Package

Posted on: Oct 20, 2011 | Duration: 2 min.
Course | 33 views
0 0
More Info +- Less Info

As electronics continue to permeate into new areas of automotive, medical, and industrial applications, packaging finds itself in the forefront of enabling new features required for growth in these markets. The need to further customize packaging for such applications will play a much bigger role moving forward in order to enable device solutions that previously were not possible.

View

Please disable any pop-up blockers for proper viewing of this course.

0 comments
write a comment

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page

×

Please Login

You will be redirected to the login page