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The Top 10 Issues That Cause Bad Prototypes

Posted on: Nov 24, 2008 | Duration: 15 Minutes
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Parts and pitch get smaller. Pin counts get larger. Design cycles get shorter. BGA, MicroBGA, QFN, DQFN, CSP packages are taking the design world by storm. Learn how to avoid the most common trip-ups when designing with these packages. Also learn how the various board finishes can impact the use of advanced package components in a prototype world.

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